✉news TechnologyAI first seen 20 h ago, last 20 min ago, peak #1
AT&S and the race to build the layers beneath AI chips
Original: Inside AT&S and the race to make the critical layer beneath AI chips
AT&S, the Austrian circuit-board maker, is at the centre of the push to produce advanced substrates — the critical layers that connect and support AI chips. With demand for AI processors surging, supply of high-end substrates has become a bottleneck, drawing attention to the small group of manufacturers capable of making them.
Why now: AI chip demand has turned substrate supply into a strategic bottleneck, putting niche makers like AT&S in the spotlight.
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