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Samsung says HBM to take nearly 30% of DRAM capacity in 2025

Original: Samsung Electronics says HBM to account for nearly 30% of industry DRAM capacity next year

Samsung Electronics said high-bandwidth memory is expected to account for nearly 30% of the industry's DRAM production capacity next year, underscoring how demand from AI data centers is reshaping the memory market. The projection highlights the rapid shift of manufacturing capacity toward HBM, a technology used alongside AI accelerators from the likes of Nvidia, and signals intensifying competition in the segment.

Why now: AI-driven demand for HBM is rapidly reshaping the DRAM industry's production priorities.

Samsung ElectronicsHBMDRAMNvidia

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