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Power Electronics
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- 1Microcontrollers now run a diffusion model and 289M-parameter LLMβMicrocontrollers now run a diffusion model and 289M LLM
Microcontrollers β tiny, low-power chips typically limited to simple tasks β can now run a diffusion model and a 289 million-parameter large language model, according to coverage by Adafruit and Open Source For You. The development suggests generative AI workloads are moving beyond GPUs and cloud servers onto minimal embedded hardware, a notable shift for edge computing and hobbyist electronics communities.
- 2Nvidia adds LG Electronics as preferred AI cooling providerβNvidia is tackling its massive AI power bottleneck by bringing LG Electronics into its Partner Network as a preferred co
Nvidia has brought LG Electronics into its Partner Network as a preferred cooling provider, aiming to ease the power and heat bottleneck facing large-scale AI data centers. The move highlights that thermal management, not just GPU supply, is becoming a decisive factor in AI infrastructure, giving LG a direct route to supply cooling technology for Nvidia systems.
- 3GlobalFoundries ships first Navitas GaN wafers from VermontβGLOBALFOUNDRIES READIES A GLOBAL GAN EXPANSION AS ITS VERMONT LINE SHIPS FIRST NAVITAS WAFERS 10 MONTHS AFTER THE TSMC L
GlobalFoundries has shipped its first gallium nitride wafers for Navitas Semiconductor from its Vermont fab, roughly ten months after taking a license arrangement linked to TSMC. The company is now preparing a broader global expansion of GaN power chip capacity. The move highlights growing demand for GaN technology in power electronics and positions GlobalFoundries as an alternative supplier as Navitas diversifies its manufacturing base.
- 4Power Electronics to build nation's largest power conversion manufacturing campusβPower Electronics building nationβs largest power conversion manufacturing campus
Power Electronics has announced plans to build the largest power conversion manufacturing campus in the United States. The facility would significantly expand domestic production of power conversion equipment used in solar and energy infrastructure projects. The announcement is drawing attention from clean energy and manufacturing observers watching how US supply chains scale up.
- 5Navitas to develop 10kV silicon carbide chips for US governmentβΌNavitas to develop 10kV SiC chips for US Government
Navitas Semiconductor has been selected to develop 10kV silicon carbide chip technology for the US government. The high-voltage SiC devices are aimed at advanced power applications, including grid infrastructure and defence-related systems. The announcement underscores growing federal investment in domestic semiconductor capabilities and wide-bandgap power electronics, a sector where Navitas has positioned itself as a key US-based player.
- 6Eaton to use Infineon silicon carbide chips in solid-state transformersβΌEaton to use Infineon SiC chips for SSTs
Power management company Eaton says it will use Infineon's silicon carbide semiconductor chips in its solid-state transformer products. The deal ties Infineon's power semiconductor technology to Eaton's electrical infrastructure equipment, as demand grows for more efficient power conversion in grids and data centers. Industry coverage highlights the partnership as a notable win for silicon carbide adoption in power electronics.
- 7Samsung puts hybrid bonding at core of DRAM roadmapβSamsung Electronics is reshaping its next-generation dynamic random-access memory roadmap, elevating its B1b wafer-to-wa
Samsung Electronics is reshaping its next-generation DRAM roadmap by elevating B1b wafer-to-wafer hybrid bonding to become the core technology behind its D0a node, according to DigiTimes Asia. The move signals Samsung's effort to stay competitive in advanced memory as the industry pushes toward denser, more power-efficient DRAM for AI and data-center demand.